| Наименование | Описание | Цена розн., у.е. | Цена 200+, у.е. | Цена 500+, у.е. | Цена 1000+, у.е. | Цена 2000+, у.е. |
|---|---|---|---|---|---|---|
| Микросхемы | ||||||
| K9F2808U0M-YCB | NAND FLASH (16 Мбайт) | 8 | 6,8 | 6,5 | 6 | 5,6 |
| K9F5608U0M-YCB | NAND FLASH (32 Мбайт) | 12 | 10,2 | 9,7 | 9 | 8,4 |
| K9F1208U0M-YCB | NAND FLASH (64 Мбайт) | 24 | 20,4 | 19,4 | 18 | 16,8 |
| K9K1G08U0M-YCB | NAND FLASH (128 Mбайт) | 39 | 33,2 | 31,6 | 29,3 | 27,3 |
| K9F1G08U0M-YCB | NAND FLASH (128 Mбайт) | 39 | 33,2 | 31,6 | 29,3 | 27,3 |
| K9K2G08U0M-YCB | NAND FLASH (256 Mбайт) | 75 | 63,8 | 60,8 | 56,3 | 52,5 |
| Карта флэш-памяти SmartMedia | ||||||
| K9S1208V0A-SSB000 | Карта SmartMedia 64 Мбайт (3,3 В) | 30 | 25,5 | 24,3 | 22,5 | 21 |
| Разъём для карты SmartMedia | ||||||
| Разъём для карты SmartMedia | 2,4 | 2,2 | 2,0 | 1,8 | 1,8 | |
| * 200+, 500+, 1000+, 2000+ - означают общую сумму покупки для получения соответствующей скидки | ||||||
| Part Number |
Organization | Operating Voltage(V) |
Temperature | Speed (ns) |
Package | Production Status |
Comments | |
|---|---|---|---|---|---|---|---|---|
| NAND | ||||||||
| K9F2808Q0B | 16M x 8 | 1.7~1.9 | C, I | 70 | 63TBGA | Engineering Sample | 0.18um | |
| K9F2808U0B | 16M x 8 | 2.7~3.6 | C, I | 50 | 48TSOP1, 63TBGA, 48WSOP1 | Mass Production | 0.18um | |
| K9F2808U0A | 16M x 8 | 2.7~3.6 | C, I | 50 | 48TSOP1 | Being Phased out | 0.22um | |
| K9F5616Q0B | 16M x 16 | 1.65~1.95 | C, I | 50 | 63TBGA | Engineering Sample(coming soon) | 0.15um | |
| K9F5616U0B | 16M x 16 | 2.7~3.6 | C, I | 50 | 48TSOP1, 63TBGA | Engineering Sample(coming soon) | 0.15um | |
| K9F5608Q0B | 32M x 8 | 1.65~1.95 | C, I | 50 | 63TBGA | Engineering Sample(coming soon) | 0.15um | |
| K9F5608U0B | 32M x 8 | 2.7~3.6 | C, I | 50 | 48TSOP1, 63TBGA, 48WSOP1 | Engineering Sample(coming soon) | 0.15um | |
| K9F5608U0A | 32M x 8 | 2.7~3.6 | C, I | 50 | 48 TSOP1 | Mass Production | 0.18um | |
| K9K1208U0A | 64M x 8 | 2.7~3.6 | C, I | 60 | 48 TSOP1, 48 WSOP | Being Phased out | 0.18um, Dual die | |
| K9F1208U0M | 64M x 8 | 2.7~3.6 | C, I | 60 | 48 TSOP1 | Mass Production | 0.15um | |
| K9F1G08U0M | 128M x 8 | 2.7~3.6 | C, I | 50 | 48 TSOP1 | Engineering Sample(coming soon) | 0.12um | |
| SmartMedia | ||||||||
| K9S3208V0A | 4M x 8 | 3.0~3.6 | 0~55°C | 50 | 22 PAD | Mass Production | — | |
| K9S6408V0A | 8M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Mass Production | — | |
| K9S2808V0A | 16M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Mass Production | — | |
| K9S2808V0B | 16M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Mass Production | — | |
| K9S2808V0M | 16M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Mass Production | — | |
| K9D5608V0M | 32M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Mass Production | Dual Chip | |
| K9S5608V0A | 32M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Mass Production | — | |
| K9S5608V0M | 32M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Mass Production | — | |
| K9S1208V0M | 64M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Engineering Sample | — | |
| K9D1208V0А | 64M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Mass Production | — | |
| K9Q1G08V0A | 128M x 8 | 2.7~3.6 | 0~55°C | 80 | 22 PAD | Mass Production | — | |
| K9D1G08V0M | 128M x 8 | 2.7~3.6 | 0~55°C | 50 | 22 PAD | Engineering Sample | — | |
| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |
| K | 9 | X | XX | XX | X | 0 | X | - | X | X | X | 0 |
| 1. Memory
K
9
F: SLC
Normal
K: SLC Die Stack S: SLC Single SM T: MLC Single SM D: SLC Dual SM G: MLC Normal L: MLC Die Stack E: MLC Dual SM 40:
4M
80: 8M 16: 16M 32: 32M 64: 64M 28: 128M 56: 256M 12: 512M 1G: 1G 08:
x8
16: x16 32: x32 64: x64 C:
5.0V(4.5V~5.5V) 7. Reserved
V: 3.3V(3.0V~3.6V) U: 2.7V~3.6V W: 2.7V~5.5V, 3.0V~5.5V 0
|
8. Version Suffix
M: 1st
Generation
A: 2nd Generation B: 3rd Generation C: 4th Generation D: 5th Generation E: 6th Generation -
C: CHIP
BIZ
J: SOJ T: TSOP2 W: WAFER G: SOP S: SmartMedia R: TSOP2(R) Y: TSOP1 C:
Commerial
I: Industrial S: SmartMedia 0: NONE S: All
Good Block
L: 1~5 Bad Block B: Include Bad Block 0: NONE(Water, CHIP BIZ) 0 |
E-mail:
sales@telesys.ru